PURPOSE: To facilitate the electrical connection of a surface layer to a transparent conductive layer by forming the conductive antireflection films in such a manner that the surface layer is a low-refractive index layer and that the high-refractive index layer under the surface layer is the transparent conductive layer.

CONSTITUTION: The transparent conductive antireflection films 21 are formed on a substrate 11. These films consist of the alternately laminated films 25 formed the substrate 11 and the transparent conductive layer 21 (high-refractive index layer H) and the surface layer 27 (low-refractive index layer L) formed thereon. The transparent conductive layer 21 exists on the second layer from the surface (atm. side). The alternately laminated films 25 consist of two-layered films; the high-refractive index layer H/low-refractive index layer L. Any layers, say, 2 layers, 4 layers and 6 layers, may be laminated thereon (between these laminated films and the transparent conductive layer) by a combination of the high-refractive index layer H/tee low-refractive index layer L. Namely, the number of laminated layers of the alternately laminated films 25 is not limited, insofar as the surface layer 27 (uppermost layer) is formed of the low-refractive u index layer L and the lower layer thereof as the transparent conductive layer 23. The transparent conductive layer 23 in the alternately laminated films H/L as the antireflection film functions as the high-refractive index layer H.