Title:
HOT-MELT COMPOSITION
Document Type and Number:
Japanese Patent JPH083526
Kind Code:
A
Abstract:
PURPOSE: To provide a hot-melt composition exhibiting excellent adhesion to a hardly adhesive substrate such as polyvinyl chloride, polypropylene or polyester and having excellent high-temperature adhesion.
CONSTITUTION: This hot-melt composition is composed of (1) 10-90wt.% of an ethylene-vinyl acetate copolymer having a [VA] of 5-50, an [MFR] of 0.1-200 and an [mp] satisfying the formula [mp]>110-5Log[MFR]-1.4-[VA] wherein [VA] is vinyl acetate content (wt.%), [MFR] is melt flow rate (g/10min) under 325g load at l25°C and [mp] is the temperature (°C) exhibiting maximum heat- absorption peak by differential scanning calorimeter(DSC), (2) 3-83wt.% of a styrene-based block polymer and (3) 7-87wt.% of a tackifier resin.
Inventors:
HAMAZAKI HIROHIDE
FUKADA TORU
FUJIWARA AKIRA
FUKADA TORU
FUJIWARA AKIRA
Application Number:
JP16327594A
Publication Date:
January 09, 1996
Filing Date:
June 22, 1994
Export Citation:
Assignee:
MITSUI DU PONT POLYCHEMICAL
International Classes:
C09J123/08; C08L31/04; C09J153/00; (IPC1-7): C09J123/08; C09J153/00
Attorney, Agent or Firm:
Yamaguchi Kazu
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