Title:
【発明の名称】基板の研磨方法および装置
Document Type and Number:
Japanese Patent JP3075510
Kind Code:
B2
Abstract:
A method and apparatus for improved control of polishing in chemical-mechanical polishing operations is provided. The polishing is controlled by applying different amounts of pressure to the surface of a substrate during polishing. A polishing pad which includes raised portions is used to apply the varying amounts of pressure. In addition, the position, size and height of the raised portions is used to affect the amount of pressure applied.
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Inventors:
William Joseph Court
Michael Francis Lofarro
Michael Francis Lofarro
Application Number:
JP1052396A
Publication Date:
August 14, 2000
Filing Date:
January 25, 1996
Export Citation:
Assignee:
International Business Machines Corporation
International Classes:
B24B37/04; B24D13/14; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Domestic Patent References:
| JP63295175A | ||||
| JP7211676A |
Attorney, Agent or Firm:
Jiro Yamamoto (2 outside)