Title:
ADDITIVE FOR ADHESIVE, AND HOT MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3038549
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain an additive for an adhesive, capable of improving compatibility of a rubber polymer, an adhesion-imparting resin and a plasticizer, and capable of providing a hot-melt adhesive excellent in adhesion to various materials to be stuck such as a polyolefin resin, cohesive power, retention of the plasticizer and processability.
SOLUTION: This additive for an adhesive comprises (A) a copolymer composed of monomers consisting essentially of (a1) a styrenic monomer, (a2) an alkyl (meth) acrylate with a 4-24C alkyl group, and/or (a3) a (meth)acrylonitrile, and having ≤20°C glass transition temperature (Tg). The component A is preferably the copolymer composed of 30-90 wt.% component (a1), 10-70 wt.% component (a2) and/or (a3), and (a4) 0-10 wt.% other monomer, and having 500-5,000 number average molecular weight.
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Inventors:
Tetsuya Shimada
Naofumi Horike
Naofumi Horike
Application Number:
JP6410398A
Publication Date:
May 08, 2000
Filing Date:
February 27, 1998
Export Citation:
Assignee:
SANYO CHEMICAL INDUSTRIES,LTD.
International Classes:
B32B27/32; C09J121/00; C09J125/04; C09J125/12; C09J125/14; C09J125/16; C09J125/18; C09J133/06; C09J133/20; C09J145/02; C09J153/00; C09J157/02; (IPC1-7): C09J125/12; B32B27/32; C09J121/00; C09J125/14; C09J125/16; C09J125/18; C09J133/06; C09J133/20
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