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Title:
IC SOCKET
Document Type and Number:
Japanese Patent JPH0729655
Kind Code:
A
Abstract:

PURPOSE: To increase the durability of a lead pin, and provide a wiping effect for a contact section by providing a socket body with a cam section for reducing the elasticity of the lead pin and horizontally rotating an electrical part at the time of fitting a presser cover.

CONSTITUTION: An IC chip board 6 is inserted in a socket body 1, with a lock plate 3 kept internally inclined about a rotating shaft 3a, and an electrode section 6a is placed on the contact section 2a of a lead pin 2. When the coupling section 5a of a presser cover 5 is placed on the plate 3 and extended in a D direction, a spring section 5b pushes down the board 6 and turns the lock plate 3 about the shaft 3a. In this case, the board 6 slightly rotates horizontally due to the action of a cam section 4, and the electrode section 6a slides on the contact section 2a, thereby performing a wiping process for removing an oxide film on the surface of the section 2a. Furthermore, the pin 2, when made of such a material as hardly undergoing elastic deformation, can be increased in durability, and improper electrical connection can be prevented via a wiping effect.


Inventors:
KAJIWARA YASUSHI
Application Number:
JP22044893A
Publication Date:
January 31, 1995
Filing Date:
July 08, 1993
Export Citation:
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Assignee:
ENPLAS CORP
International Classes:
H01L23/32; H01R33/76; (IPC1-7): H01R33/76; H01L23/32



 
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