Title:
MANUFACTURE OF ALUMINUM NITRIDE SINTER
Document Type and Number:
Japanese Patent JP2553268
Kind Code:
B2
Abstract:
PURPOSE: To provide a manufacture of an aluminum nitride sinter which has a good bonding with a conductive layer and has a strong bonding strength of plating to a surface of the conductive layer when manufacturing the aluminum nitride sinter whose conductive layer is a metal having a high melting point.
CONSTITUTION: A conductive paste stack molding, in which a conductive paste layer consisting of 100 parts by weight of a metal powder having a high melting point with the average grain diameter of 0.8 to 5μm and 2 to 10 parts by weight of an aluminum nitride is formed, is sintered on a surface of a molding consisting of the aluminum nitride, a sintering assistant, and an organic binding agent under a non-oxidizable atmosphere of 1400 to 2100°C after a residual carbon rate is decreased to 2000ppm or less by a high degreasing, for example, under a moistened reducing gas atmosphere of 700 to 1200°C.
Inventors:
NUMATA YOSHIHIKO
YAMAMOTO TAMAO
YAMAMOTO TAMAO
Application Number:
JP24955891A
Publication Date:
November 13, 1996
Filing Date:
September 27, 1991
Export Citation:
Assignee:
TOKUYAMA CORP
International Classes:
H01L23/12; H05K1/09; H05K3/12; H05K3/38; (IPC1-7): H01L23/12; H05K1/09; H05K3/12