Title:
STRUCTURE OF LC CIRCUIT
Document Type and Number:
Japanese Patent JPH0637255
Kind Code:
A
Abstract:
PURPOSE: To provide an LC circuit structure which can be lessened in chip area and length of connecting wiring so as to be minimized in influence to microwave characteristics.
CONSTITUTION: A capacitor C and an inductor L are vertically provided onto a substrate 1 through the intermediary of an insulating film 5, and the capacitor C and the inductor L are electrically connected together with a connecting wiring 6 formed penetrating the insulating film 5.
Inventors:
NAKAGAWA YOSHIKAZU
Application Number:
JP18687292A
Publication Date:
February 10, 1994
Filing Date:
July 14, 1992
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01L27/04; H01L21/822; (IPC1-7): H01L27/04
Attorney, Agent or Firm:
Sota Asahina (2 outside)
Next Patent: WORK INDICATION METHOD