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Patent Searching and Data


Title:
FLEXIBLE PRINTED WIRING BOARD AND CONNECTION STRUCTURE EMPLOYING THE FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH087947
Kind Code:
A
Abstract:

PURPOSE: To strengthen junction by means of a flexible printed patch board in the case that two connected substrates such as a liquid crystal panel, a circuit substrate and the like are connected to each other by the flexible printed patch board.

CONSTITUTION: Each connecting section 2a of a flexible printed patch board is brough in contact with the respective electrode terminal sections 6a and 7a of a liquid crystal panel 6 and a circuit substrate 7 which are the substrates to be connected, they are fixed thereto with a hot melt boding agent 5, and the respective connected substrates are connected in such a way as to be conductive. Each connecting section 2a is provided with projected sections 2b which are extended with their width specified, Anchoring the outer side of the respective connecting sections onto the respective electrode terminal sections 6a and 7a makes it difficult that they are peeled off. The respective projected sections 2b are fixed onto the respective connected substrates by a pressure sensitive adhesive tape 10, they can not be peeled off even if they are subjected to external force caused by stresses applied during an assembly process, dislocation for installation and the like.


Inventors:
FUKUDA SHIRO
Application Number:
JP14303794A
Publication Date:
January 12, 1996
Filing Date:
June 24, 1994
Export Citation:
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Assignee:
SEIKOSHA KK
International Classes:
H05K1/02; H05K1/14; H05K1/00; H05K3/36; (IPC1-7): H01R9/09; H05K1/02; H05K1/14
Attorney, Agent or Firm:
Kazuko Matsuda