Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2550319
Kind Code:
B2
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Inventors:
HATAKEYAMA MIKIO
Application Number:
JP9726686A
Publication Date:
November 06, 1996
Filing Date:
April 25, 1986
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L29/74; (IPC1-7): H01L29/74
Domestic Patent References:
| JP5778171A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)