Title:
IC CARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH0664379
Kind Code:
A
Abstract:
PURPOSE: To increase the strength against bending and, at the same time, make it possible to produce a large scale circuit at the formation of semiconductor chips mainly housed in an IC card.
CONSTITUTION: The thickness of a semiconductor chip 3 formed on a card bed 1 is set to be 10μm or less by grinding the rear surface of a matrix or producing semiconductor layer on the card bed 1.
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Inventors:
KATO TERUO
Application Number:
JP21509992A
Publication Date:
March 08, 1994
Filing Date:
August 12, 1992
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
B42D15/10; G06K19/077; H01L21/02; H01L21/336; H01L27/12; H01L29/78; H01L29/786; (IPC1-7): B42D15/10; G06K19/077; H01L29/784
Attorney, Agent or Firm:
Toshiaki Suzuki
Next Patent: IC CARD