PURPOSE: To provide a method for mounting an electronic component on a double-sided printed board in which floating of leads at the time of solder reflowing, dropping of the component can be prevented.
CONSTITUTION: QFP type semiconductor components 2, 3 are mounted on a double-sided printed board by a solder reflowing method. Four corners of a resin-molded package of the component 2 of a surface B in which reflow soldering is finished are so coated with thermosetting adhesive 4 as to enclose the four corners over a height of a top 2a of a taper formed at the time of molding. The adhesive 4 is cured at a stage of preheating the component 3 of a surface A at the time of solder reflowing, and the component 3 is held. Drop of the component 2 due to deterioration of draping of adhesive with mold release agent at the time of transfer molding adhered to a surface of a resin mold can be prevented by holding it with the adhesive 4.
MIIKEDA KAORU
ASAGI OSAMU
ARAI MASATAKA
