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Patent Searching and Data


Title:
PREPARATION OF WATER LEAK DETECTION WIRE
Document Type and Number:
Japanese Patent JPH055669
Kind Code:
A
Abstract:

PURPOSE: To enhance the peel strength of a conductor strip and a strip like insulator to a large extent by continuously and thinly applying a thermosetting adhesive to the under surface of the conductor strip.

CONSTITUTION: In subjecting a strip like insulator 2 to extrusion coating, a thermosetting adhesive 12 capable of being bonded to conductor strips 6, 8 and the insulator 2 by the heat at the time of the extrusion coating of the insulator 2 is continuously and thinly applied to the under surfaces of the conductor strips 6, 8. The insulator 2 is composed of heat-resistant polyvinyl chloride and each of the strips 6, 8 is composed of a horizontal stainless steel tape having no slope and the adhesive 12 is pref. a vinyl acetate type adhesive. Since the strips 6, 8 can be formed from copper or tin plated copper and the insulator 2 can be formed using polyethylene, as the adhesive 12, the optimum one is selected according to a material. In the water leak detection wire 1a thus prepared, the strips 6, 8 are not peeled off by peeling force of below about 300gf even if they are pulled from the insulator 2 in a vertical direction.


Inventors:
TOKORO TOSHIO
OKITA HIROSHI
SONE SEIICHIRO
Application Number:
JP32198991A
Publication Date:
January 14, 1993
Filing Date:
December 05, 1991
Export Citation:
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Assignee:
SHOWA ELECTRIC WIRE & CABLE CO
International Classes:
G01M3/16; G01N27/07; (IPC1-7): G01M3/16; G01N27/07
Domestic Patent References:
JPS5813062A1983-01-25
JPS5813057A1983-01-25
JPS57163557A1982-10-07
JPS57203541A1982-12-13
Attorney, Agent or Firm:
Akinobu Yamada