Title:
【発明の名称】半導体封止用樹脂組成物
Document Type and Number:
Japanese Patent JP3080276
Kind Code:
B2
Abstract:
PURPOSE:To improve solder crack resistance, moisture resistance, and heat resistance by containing epoxy resin, a hardener and an inorganic filler, which contain specified amounts of specified denatured phenol resin compositions, as resin composition for sealing semiconductors, for its mandatory ingredients. CONSTITUTION:This is a resin composition consisting of epoxy resin, which contains 5-100wt.% biphenyl epoxy resin expressed by formula II (R1, F2, R3, and R4 are H or CH3) to a total quantity of epoxy resin, a hardener, which contains 50-100wt.% denatured biphenyl resin compositions expressed by formula I (R1, R2, and R3 are any of H, CH3, and OH) (l=1-10, m=1-10, n=1-10) to a total quantity of hardener, and an inorganic filler, which contains them by 75-90wt.% to all compositions. The inorganic fillers can be mixed in large quantity without losing the fluidity, since the melt viscosity of the fused epoxy resin itself is low, by using the biphenyl epoxy expressed by the formula II, so strong resin compositions little in moisture adsorption and excellent in solder stress property can be gotten.
Inventors:
Hiroyuki Suzuki
Application Number:
JP25447292A
Publication Date:
August 21, 2000
Filing Date:
September 24, 1992
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/20; C08G59/62; C08K3/00; C08L63/00; H01L23/29; H01L23/31; C08G59/24; (IPC1-7): H01L23/29; C08G59/24; C08G59/62; C08L63/00; H01L23/31
Domestic Patent References:
| JP275619A | ||||
| JP2155914A | ||||
| JP2189327A | ||||
| JP2209948A | ||||
| JP4103619A |