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Title:
MANUFACTURE OF MULTILAYER CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH0669370
Kind Code:
A
Abstract:

PURPOSE: To raise the reliability on electric connection as compared with the case of bringing a film-shaped metallic foil into contact with it, by providing an electrically conductive solution-form paste layer on a signal takeout part or a surface conductor layer, and supplying power through this paste layer.

CONSTITUTION: This board comprises a ceramic board 1, a conductor layer 3, which is formed on the surface of the ceramic board 1 or on the surface through an insulating layer, and a signal takeout part, which is connected electrically to the conductor layer 3. What is more, the signal takeout part is provided with a signal takeout pin 2. Moreover, the signal takeout part is provided with a paste layer by applying electrically conductive paste 4, and electrolytic plating is performed by supplying the conductor layer 3 with power through the paste layer and the signal takeout part. And, the thickness of the conductor layer 3 is controlled by forming a plated layer on the surface of the conductor layer 3, and then the paste layer is removed. Hereby, favorable electrolytic plating of the signal takeout part can be performed.


Inventors:
SHIBATA KAZUYOSHI
HAMA SUSUMU
Application Number:
JP21693292A
Publication Date:
March 11, 1994
Filing Date:
August 14, 1992
Export Citation:
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Assignee:
NGK INSULATORS LTD
International Classes:
H01L23/12; H05K3/46; (IPC1-7): H01L23/12; H05K3/46
Attorney, Agent or Firm:
Akihide Sugimura (5 outside)



 
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