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Title:
PHOTO-SETTING RESIN COMPOSITION FOR ELECTRIC AND ELECTRONIC PART
Document Type and Number:
Japanese Patent JPH0616749
Kind Code:
A
Abstract:

PURPOSE: To obtain a photo-setting resin composition easily polymerizable and curable by the irradiation of light to form a cured coating film having little gas emission and exerting little influence on the adherend coated with the composition by compounding a photo-setting resin component with a specific photopolymerization initiator.

CONSTITUTION: The composition is produced by compounding (A) a photo-setting resin component with (B) a photopolymerization initiator consisting of a compound containing a (meth)acryloyl group and obtained by reacting (i) an active hydrogen-containing compound capable of generating radicals by photo- irradiation (preferably 1-hydroxycyclohexyl phenyl ketone, etc.) with (ii) a (meth) acryloyl isocyanate of formula (R is H or CH3). The amount of the component B is preferably 0.5-20 pts.wt. based on 100 pts.wt. of the component A. The component A is e.g. unsaturated polyester and epoxy (meth)acrylate.


Inventors:
HIBINO SATORU
Application Number:
JP21445492A
Publication Date:
January 25, 1994
Filing Date:
July 03, 1992
Export Citation:
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Assignee:
THREE BOND CO LTD
International Classes:
C08F2/50; C08F20/52; C08F220/58; C08F290/00; C08F299/00; C09J4/00; C09J4/02; (IPC1-7): C08F299/00; C08F2/50; C08F220/58; C09J4/00
Attorney, Agent or Firm:
Takehiko Saito (1 outside)