【発明の名称】半導体装置の製造方法

Title:

【発明の名称】半導体装置の製造方法

Document Type and Number:

Japanese Patent JP2586431

Kind Code:

B2

Inventors:

YAMANE HIROYUKI
HIGUCHI YASUSHI
FUJII TETSUO

Application Number:

JP17455586A

Publication Date:

February 26, 1997

Filing Date:

July 24, 1986

Export Citation:

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Assignee:

DENSOO KK

International Classes:

H01L21/302; H01L21/306; H01L21/3065; H01L21/31; H01L21/316; H01L21/76; (IPC1-7): H01L21/316; H01L21/306; H01L21/3065; H01L21/76

Domestic Patent References:

JP56103445A
JP5741101B2

Attorney, Agent or Firm:

Takehiko Suzue (2 outside)

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