PURPOSE: To provide a copper alloy lead frame for bear bonding excellent in the adhesion of an oxidized film.

CONSTITUTION: This lead frame for a bear bonding is one in which nickel plating or noble metal plating is omitted and chips are directly die-bonded or wire-bonded to a copper alloy lead frame. The lead frame used for the bear bonding is constituted of a copper alloy having a compsn. contg. iron and phosphorus and in which the wt.% ratio of iron to phosphorus (Fe/P) is regulated to 2 to 4 and the content of phosphorus is regulated to ≤0.05%. This copper alloy is one in which electric conductivity is regulated to ≥90% IACS, (O1S)/(Cu2P), i.e., the ratio of the oxygen peak intensity to the copper peak intensity in the value of the X-ray photoelectric analysis showing a surface oxidizing state is regtulated to ≤0.6 and (N1S)/(Cu2P), i.e., the ratio of the nitrogen peak density to the copper peak density in the value of the X-ray photoelectron spectroscopy showing the coating weight of a rust preventive film is regulated to ≤0.1.