Title:
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH0629401
Kind Code:
A
Abstract:
PURPOSE: To reduce a period of time for fabricating a semiconductor device having a multi-layered structure including contact holes in its central areas.
CONSTITUTION: After successively fabricating insulating films 3, 5, 7, and 9 and wiring layers 4, 6, and 8, contact holes 10 are formed at a time so as to pass through a plurality (all layers for the embodiment example) of wiring layers (including the insulating film) 3-9.
Inventors:
KANEKO KOICHI
Application Number:
JP18376892A
Publication Date:
February 04, 1994
Filing Date:
July 10, 1992
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L23/522; H01L21/768; (IPC1-7): H01L21/90
Attorney, Agent or Firm:
Toshiaki Suzuki
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