Title:
【発明の名称】半導体装置用部材
Document Type and Number:
Japanese Patent JP2523162
Kind Code:
B2
Inventors:
SASAME AKIRA
SAKAGAMI HITOSHI
MYAKE MASAYA
YAMAKAWA AKIRA
SAKAGAMI HITOSHI
MYAKE MASAYA
YAMAKAWA AKIRA
Application Number:
JP16226188A
Publication Date:
August 07, 1996
Filing Date:
June 29, 1988
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L23/36; B32B15/04; C04B37/02; H01L23/12; H01L23/14; H01L23/15; H01L23/373; (IPC1-7): H01L23/12; H01L23/14; H01L23/373
Domestic Patent References:
| JP61225823A | ||||
| JP63195745U | ||||
| JP7114245B2 |
Attorney, Agent or Firm:
Akira Wada