Title:
【発明の名称】半導体装置のへき開方法
Document Type and Number:
Japanese Patent JP3058196
Kind Code:
B2
Inventors:
Junichi Hashimoto
Application Number:
JP6006991A
Publication Date:
July 04, 2000
Filing Date:
March 25, 1991
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H01L21/301; H01L21/78; H01S5/00; H01S5/30; (IPC1-7): H01L21/301; H01S5/30
Domestic Patent References:
| JP62193800A | ||||
| JP647515B2 |
Attorney, Agent or Firm:
Yoshiki Hasegawa (3 outside)