PHOTOSENSITIVE RESIN COMPOSITION

Title:

PHOTOSENSITIVE RESIN COMPOSITION

Document Type and Number:

Japanese Patent JP2541364

Kind Code:

B2

Abstract:

PURPOSE: To provide a photosensitive resin compsn. capable of giving a relief plate having slight surface adhesiveness and retaining this effect without passing through a troublesome process.
CONSTITUTION: A photosensitive resin compsn. contg. a soluble synthetic high molecular compd., a photopolymerizable unsatd. compd., a photopolymn polymn. initiator and a surface adhesion inhibitor is prepd. Since the compatibility of the surface adhesion inhibitor with a mixture contg. the soluble high molecular compd., the unsatd. photo-polymerizable compd. and the photopolymn. initiator in the photosensitive resin compsn. after photosetting is lower than that before photosetting, the inhibitor bleeds out of the photosensitive resin compsn. after photosetting and forms a film on the surface of the compsn.

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Inventors:

TAGUCHI JUJI
FUJIMURA TOSHIAKI

Application Number:

JP17514191A

Publication Date:

October 09, 1996

Filing Date:

July 16, 1991

Export Citation:

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Assignee:

TOYO BOSEKI

International Classes:

G03F7/00; G03F7/004; G03F7/027; G03F7/031; G03F7/035; G03F7/037; G03F7/039; (IPC1-7): G03F7/004; G03F7/00; G03F7/004; G03F7/027; G03F7/031; G03F7/035; G03F7/037

Domestic Patent References:

JP63163338A
JP50160033A
JP4822345B1

Attorney, Agent or Firm:

Shusaku Yamamoto

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