PURPOSE: To manufacture the title ceramic electronic part provided with copper terminal electrode having no crack at all during the rapid heating process by a method wherein both ends or sides of a ceramic element assembly are coated with a copper electrode paste comprising the copper powder in specific surface area so as to form the copper terminal electrode by baking process.
CONSTITUTION: Both ends or sides of a ceramic element assembly (A) with a copper terminal electrode to be formed therein of the title ceramic electronic part are coated with a copper electrode paste (B) comprising the copper powder in specific surface area of 1.0-2.0m2/g so as to form said copper terminal electrode by baking process (C). The ceramic electronic part is manufactured through the processes B, C wherein the ceramic element assembly coated with the copper electrode paste is baked in a neutral atmosphere and then successively through the other processes D, E wherein the copper electrode is plated with conductive materials by electroplating process. In this case, the conductive materials contain e.g. nickel, tin alloy and copper.
FUJISHIRO YOSHIKAZU
KOUEN MAKOTO
| JPH036005A | 1991-01-11 | |||
| JPS5944031U | 1984-03-23 |