Title:
NEGATIVE RADIATION SENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3050215
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a negative radiation sensitive resin composition superior in developability, pattern forms, resolution, adhesion, focus allowance, and film endurance, and good in stability, and favorably usable for radiation shorter in wavelength than far ultraviolet rays, such as excimer laser beams.
SOLUTION: This radiation sensitive resin composition comprises (1) an alkali-soluble resin, (2) a radiation sensitive acid generator, (3) a compound for cross-linking the alkali-soluble resin (1) in the presence of an acid, and an N-containing basic compound, such as ammonia, triethylamine, imidazole, pyridine, and 4,4'-diaminodiphenylmethane.
Inventors:
Makoto Murata
Toshiyuki Ohta
Kiji Yumoto
Takao Miura
Toshiyuki Ohta
Kiji Yumoto
Takao Miura
Application Number:
JP33820998A
Publication Date:
June 12, 2000
Filing Date:
November 27, 1998
Export Citation:
Assignee:
JSR Corporation
International Classes:
G03F7/004; G03F7/038; H01L21/027; (IPC1-7): G03F7/038; G03F7/004; H01L21/027
Domestic Patent References:
| JP387748A | ||||
| JP3144650A | ||||
| JP451243A | ||||
| JP4178648A | ||||
| JP527421A | ||||
| JP5127369A | ||||
| JP5249662A |
Attorney, Agent or Firm:
Masataka Oshima