Title:
MANUFACTURE OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH0529752
Kind Code:
A
Abstract:
PURPOSE: To make it possible to eliminate the generation of an uneven film thickness and oozing of solder resist, screen-print with solder resist by a fine pattern and form a fine solder land as well.
CONSTITUTION: Solder resist 60 is screen-printed with etching resist 3 which is arranged to remain in a process which forms printed wiring circuit 5 on the upper side of an insulation board 4. Then, the etching resist 3 is removed and the solder resist 60a on the resist 3 is also removed simultaneously so that a flat surface may be formed on the surface of a printed wiring circuit.
Inventors:
MATSUMOTO MASUO
Application Number:
JP20761291A
Publication Date:
February 05, 1993
Filing Date:
July 24, 1991
Export Citation:
Assignee:
NIPPON CMK KK
International Classes:
H05K3/28; H05K3/06; (IPC1-7): H05K3/28
Attorney, Agent or Firm:
Takeshi Nara
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