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Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2604470
Kind Code:
B2
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Inventors:
Yasumasa Saito
Kazuo Matsuzaki
Amano Akira
Application Number:
JP16294889A
Publication Date:
April 30, 1997
Filing Date:
June 26, 1989
Export Citation:
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Assignee:
Tottori Electric Manufacturing Co., Ltd.
Fuji Electric Co., Ltd.
International Classes:
H01L23/14; H01L21/52; (IPC1-7): H01L23/14
Domestic Patent References:
JPS57159033A
Attorney, Agent or Firm:
Iwao Yamaguchi



 
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