Title:
FORMATION METHOD OF METAL WIRING
Document Type and Number:
Japanese Patent JPH0574768
Kind Code:
A
Abstract:
PURPOSE: To provide a method of forming a metal wiring on a board without using resist.
CONSTITUTION: The surface of an oxide layer 3 of a wiring material 2 is irradiated with light rays 5 of short waves through the intermediary of a mask 4, and the wiring material 2 is etched using the non-irradiated part of the oxide layer 3 as a mark for the formation of a wiring 6 of required pattern on the board 1.
Inventors:
SUGITA YOSHIHIRO
NARA YASUO
NARA YASUO
Application Number:
JP23648791A
Publication Date:
March 26, 1993
Filing Date:
September 17, 1991
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/302; H01L21/3205; H01L21/3213; (IPC1-7): H01L21/302; H01L21/3205
Attorney, Agent or Firm:
Aoki Akira (3 outside)
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