Title:
【発明の名称】メッシュ張り替え方法およびプロセスデバイス合体シミュレ―ションシステム
Document Type and Number:
Japanese Patent JP3026807
Kind Code:
B1
Abstract:
PROBLEM TO BE SOLVED: To provide a mesh repairing method and a process device uniting simulation system, which convert material and a mesh shape in process simulation into material and a mesh shape which are suitable for use in device simulation. SOLUTION: When process simulation and device simulation are executed continuously, the mesh of the device simulation is defined, an element surrounded by rectangular mesh for the device simulation is divided into blocks of the same shape, material to which the center of gravity of each block belongs is retrieved from among material data used for the process simulation, material occupying the most blocks is selected from among material to which the center 4 of gravity of each block belongs, and processing that selects the material occupying the most blocks as the material for an element of the device simulator is carried out for all elements used in the device simulation.
Inventors:
Sato Shigeo
Application Number:
JP19345899A
Publication Date:
March 27, 2000
Filing Date:
July 07, 1999
Export Citation:
Assignee:
Semiconductor Leading Edge Technologies, Inc.
International Classes:
H01L29/00; G06F17/50; G06T17/20; H01L21/00; (IPC1-7): G06T17/20; H01L29/00
Other References:
法政大学工学部研究集報 第３５号 １−７頁 山口聡ほか「プロセス・デバイスシミュレーションにおける整合問題について」
Attorney, Agent or Firm:
Mamoru Takada (2 outside)