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Title:
DIE COATING METHOD AND COAT WIDTH ADJUSTMENT TOOL
Document Type and Number:
Japanese Patent JPH0647332
Kind Code:
A
Abstract:

PURPOSE: To ensure that the width of an applied coat can be adjusted easily by allowing a support bar to come in contact with a slit with the movement of a film in the flow direction of a coating liquid and sealing the slit partially from the lateral end of a die to a center direction and applying a coat with a specified coating width.

CONSTITUTION: This die coating method is to distribute a coating liquid to be supplied into a die (a) in a die coater using a manifold (c), then squeeze out the liquid through the slit in a film form, and apply it to the surface of a running sheet. Further, a support bar 1 with a larger outer diameter than the slit (d) and around which so many pieces of film 2 with a thickness which enables the film to fit to the slit (d) can be wound is inserted into the manifold (c) from the lateral wall of the die (a) in a liquid-sealed condition, and the so many pieces of film 2 are arranged in the slit (d). Next, the support bar 1 is allowed to come in contact with the slit (d) by movement of the film 2 in the flow direction of the coating liquid, thereby, the slit (d) is partially sealed from the lateral end of the die (d) to the center direction, and the coating liquid is applied with a specified width.


Inventors:
ICHIKAWA KUNIHIKO
MISHIMA KIYOSHI
MAKINO SHINICHI
YOSHIKAWA TAKEFUMI
Application Number:
JP26313091A
Publication Date:
February 22, 1994
Filing Date:
September 13, 1991
Export Citation:
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Assignee:
MITSUBISHI CHEM IND
International Classes:
B05C5/02; B05D1/26; (IPC1-7): B05C5/02; B05D1/26
Attorney, Agent or Firm:
Kazuhiko Okada



 
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