Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP3073644
Kind Code:
B2
Abstract:
A semiconductor device includes a chip, a chip mounting plate, a heat radiating plate, first and second bumps, a conducting path forming member and a package. The chip has a semiconductor element in its main surface, and the rear surface thereof is mounted on the chip mounting plate with conductive adhesive. The chip mounting plate includes an insulating plate on which projecting portions are provided at corner portions, and a metal layer for covering the surface on which the chip is mounted. The projecting portions are formed such that the bottom surfaces thereof and the main surface of the chip are located on the same plane when the chip is mounted. The chip mounting plate is fixed to the heat radiating plate with adhesive. A first conducting path is provided on one surface of the conducting path forming member and a second conductive path is formed within the conducting path forming member. Bumps for connecting external terminals, which are electrically connected to the second conducting path are provided on the other surface of the conducting path forming member. The electrode of the chip is connected to the first conducting path via the first bumps, and the projecting portions are connected to the first conducting path via the second bump. The chip, the chip mounting plate, a portion of the heat radiating plate and a portion of the conducting path forming member are sealed in the package.
More Like This:
| WO/2014/208010 | MICROWAVE CIRCUIT |
| WO/2019/167436 | ANTENNA MODULE AND COMMUNICATION DEVICE |
| JPH1187409 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF |
Inventors:
Hiroyuki Kozono
Application Number:
JP33742093A
Publication Date:
August 07, 2000
Filing Date:
December 28, 1993
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L23/12; H01L23/31; H01L23/433; (IPC1-7): H01L23/12
Domestic Patent References:
| JP5144971A |
Attorney, Agent or Firm:
Takehiko Suzue