Title:
REMOVER COMPOSITION OF STAIN ADHERING TO RESIN MOLDING DIE
Document Type and Number:
Japanese Patent JP3038536
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To realize the quick, easy and economical removal of stains due to the gas adhering to a resin molding die without damaging the molding die by a method wherein a composition mainly made of methylene chloride, methyl celluloses, alcohol compatible with methylene chloride and paraffin wax is employed.
SOLUTION: An agent composition, which is prepared by combiningly compounding methylene chloride, alcohols, paraffin wax and methyl celluloses, is employed. To be more precise, an agent, the essential components and their compounding ratios of which are 50% or more of methylene chloride, 10-30% of alcohol miscible with methylene chloride, 0.5-5.0% of paraffin wax having the melting point of 75°C or lower and 0.1-2.0% of methyl celluloses, is employed. Further, when necessary, 0.5-5.0% of higher fatty acid such as palmitic acid, stearic acid or the like and 1.0-20% of water are added to the above- mentioned main agent, resulting in enhancing the performance of the agent. The viscosity of remover properly lies within the range of 10-1,000cps, especially preferably lies within the range of 20-300cps.
Inventors:
Tadaharu Miura
Koichi Zhu
Koichi Zhu
Application Number:
JP11013896A
Publication Date:
May 08, 2000
Filing Date:
April 04, 1996
Export Citation:
Assignee:
Kobe Gosei Co., Ltd.
International Classes:
B29C33/72; C09K3/22; C11D7/60; (IPC1-7): B29C33/72; C09K3/22; C11D7/60
Domestic Patent References:
| JP5104539A | ||||
| JP1216809A | ||||
| JP1204999A | ||||
| JP62184060A | ||||
| JP61235500A | ||||
| JP61159499A | ||||
| JP58119828A |
Attorney, Agent or Firm:
Kazuomi Ogawa