PURPOSE: To obtain a photosensitive resin composition having excellent physical properties at high-temperature and high hardness at room temperature and usable in a wide application field such as various relief printing plates, photosetting paints and selective permeation membranes.
CONSTITUTION: This photosensitive resin composition contains, as principal components, (A) a soluble synthetic polymer compound, preferably an addition polymer obtained by the reaction of a diamine having primary or secondary amino group and free from amide bond in the skeleton with a diisocyanate compound, containing 20-80wt.% of polyoxyalkylene glycol component in the main chain of the polymer and having (meth)acryloyl group as a part or total of the terminal groups, (B) photopolymerizable unsaturated compounds containing 3-6 (meth)acrylate groups and one ether bond in one molecule of at least one of the constituent compounds and (C) a photopolymerization initiator. Preferably, the amount of the component B is 10-150 pts.wt. based on 100 pts.wt. of the component A and that of the component C is 0.05-5wt.% based on the total composition.
KAWAHARA TOSHIKAZU
OYOKU AKITADA
