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Title:
DIAMOND CUTTER
Document Type and Number:
Japanese Patent JPH081524
Kind Code:
A
Abstract:

PURPOSE: To provide a diamond cutter capable of preventing notches generated in the foundation layer in laser welding and making chips rare to flow into the lower part of a segment chip.

CONSTITUTION: In a diamond cutter having a segment chip 2 consisting of an abrasive layer 2a having diamond abrasives and a foundation layer 2b and fixedly attached to the circumference of a base metal 1 formed of a disk-like base plate provided on the circumference with a groove 3, the width of a gap in the abrasive layer 2a of the segment chip 2 is made winder than the width of an inlet of the groove 3 and the segment chip 2 is provided on the lower end face with an inclination 2c having a predetermined rake angle α.


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Inventors:
MATSUKAWA MASANORI
ITO SEIJI
NAGAI YOSHITERU
Application Number:
JP13590594A
Publication Date:
January 09, 1996
Filing Date:
June 17, 1994
Export Citation:
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Assignee:
NORITAKE DIA KK
International Classes:
B24D5/00; B24D5/06; B24D5/12; B24D99/00; (IPC1-7): B24D5/12; B24D5/00; B24D5/06; B24D17/00
Domestic Patent References:
JPS61153993A1986-07-12
JPH05345280A1993-12-27
JPH0417057U1992-02-12
JPH03277477A1991-12-09
JPH03221281A1991-09-30
JPS6456963U1989-04-10
JPH04112775U1992-09-30
JPH0539863U1993-05-28
JPS6360558U1988-04-22
Attorney, Agent or Firm:
Kobori Masashi