Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2547870
Kind Code:
B2
More Like This:
Inventors:
KOSEKI YASUHIRO
Application Number:
JP28023789A
Publication Date:
October 23, 1996
Filing Date:
October 27, 1989
Export Citation:
Assignee:
YAMAGATA NIPPON DENKI KK
International Classes:
H01L29/73; H01L21/331; H01L29/732; (IPC1-7): H01L21/331; H01L29/73
Domestic Patent References:
| JP63204646A | ||||
| JP58182259A |
Attorney, Agent or Firm:
Yusuke Omi