PURPOSE: To provide a storage device which prevents a semiconductor device from dropping, and can contain a semiconductor device without deforming the lead wire of the semiconductor device.

CONSTITUTION: Leading end parts 8 of an upper opening part for a storage device 5 are processed to be a pulse-form. Recessed parts 7 are formed on a semiconductor device 1. From a lower opening part of the storage device 5, the semiconductor device l with recessed parts 7 is placed, and the leading end parts 8 at the upper opening part of the storage device 5 are inserted in the recessed parts 7 of the semiconductor device 1 and fixed. In addition, the fixation of the semiconductor device 1 is stabilized by equipping an under tape 6. By this method, the semiconductor device 1 is prevented from dropping, and also a lead wire 2 of the semiconductor device can be prevented from being deformed.