Title:
ELECTRONIC PARTS MOUNTING BOARD
Document Type and Number:
Japanese Patent JPH0629421
Kind Code:
A
Abstract:
PURPOSE: To accurate position electronic parts.
CONSTITUTION: There are provided an insulating board 9 and a recess 1 formed on the insulating board 9 for mounting electronic parts. A protrusion 10 is provided in the recess 1 to position electronic parts. The recess 1 is typically opened in a square shape. The protrusion 10 is formed on an opening surface of the recess 1 at one or more locations. Flat planes 100 protrude into a shape to support the side surfaces 30 of the electronic parts 3. Upon formation of the protrusion 10, it is preferably formed simultaneously with the formation of the recess 1 is the insulating substrate 9 through a router processing.
Inventors:
KAWADE MASANORI
ISHIDA NAOTO
ISHIDA NAOTO
Application Number:
JP20606292A
Publication Date:
February 04, 1994
Filing Date:
July 09, 1992
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H01L23/12; H05K1/02; H05K1/18; (IPC1-7): H01L23/12; H05K1/02; H05K1/18
Attorney, Agent or Firm:
Yoshiyasu Takahashi
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