PURPOSE: To improve the lightening and heat dissipation capability of a metal base printed wiring board having a multilayer on one side thereof by integrating a metal plate having through holes and a double-sided printed wiring board via an insulating adhesive layer.
CONSTITUTION: Metal plate 1 having through holes 2 is integrated with a double-sided printed wiring board 4 made of prepreg containing inorganic filler via an insulating adhesive layer 3. The double-sided printed wiring board 4 made of the prepreg containing inorganic filler is a multilayered plate, wherein a required circuit is fabricated on a metal foil installed on the outer side of the prepreg containing inorganic filler, wherein the first circuit pattern 6 and the second circuit pattern 7 are laid on both sides of the multilayered plate, respectively, and wherein both circuit patterns are partly conducted via through holes. Since the printed wiring board has such a structure, heat generated from electronic and electric parts 5 mounted on the double- sided printed wiring board 4 passes through the double-sided printed wiring board 4 containing inorganic filler superior in heat conductivity and through an insulating adhesive layer 3 superior in heat conductivity, then flows in the metal plate, and is dissipated outside.
TAMEI MASAKATSU
NEMOTO KAZUHIKO
