Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE TAPE CARRIER AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0563035
Kind Code:
A
Abstract:
PURPOSE: To provide a semiconductor tape carrier which is designed to protect and inner lead from contact with the edge of a chip during the process of inner lead bonding.
CONSTITUTION: A tape carrier comprises a plurality of wiring leads 20 and supporting members 1 where the wiring boards 20 form one plane. The portions of the wiring leads connected with chips or the tip of the inner lead 2 is bent upward or downward to the plane. This construction makes it possible to protect the inner from contact with the edge of chips in this bonding process.
Inventors:
OHIRA HIROYUKI
ONO JUNICHI
ONO JUNICHI
Application Number:
JP24518991A
Publication Date:
March 12, 1993
Filing Date:
August 30, 1991
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L21/60; H01L21/321; (IPC1-7): H01L21/321; H01L21/60
Attorney, Agent or Firm:
Toshi Takemura
Next Patent: JPH0563036