Title:
【考案の名称】自動制御式ランダム軌道研磨装置
Document Type and Number:
Japanese Patent JPH0585543
Kind Code:
U
Abstract:
The present invention relates to an automated random, orbital abrading apparatus (10) and a method and apparatus for positioning the back-up pad (34) of the apparatus at a known location within its range of motion at the end of an abrading cycle.
Inventors:
David John Lanzer
Application Number:
JP1870693U
Publication Date:
November 19, 1993
Filing Date:
April 13, 1993
Export Citation:
Assignee:
Minnesota Mining and Manufacturing Company
International Classes:
B24B23/03; B24B45/00; B24D9/08; B24B27/00; (IPC1-7): B24B27/00; B24B45/00
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)