PURPOSE: To improve a temperature rise speed and uniformity of a substrate by constituting the structure so that high temperature gas for reflow blown to a substrate loaded with parts can circulate smoothly.
CONSTITUTION: In an inner bottom part of a reflow furnace 11, an air blower 12 is provided, and a guide plate 13 is provided along an inner wall of one side of the reflow face from the periphery of this air blower 12. By this guide plate 13, a heater 15 is provided in an air current ascending passage 14 divided and formed in the furnace. In the upper end part of this passage 14, an inclined nozzle 16 is provided continuously. In a bottom part of the reflow furnace 11, an inert gas injecting port 17 for nitrogen gas, etc., is provided. To the substrate surface of a substrate W loaded with parts carried into the reflow furnace 11 by a conveyor 21, the inclined nozzle 16 blows high temperature gas obliquely from one side. Accordingly, the high temperature gas blown to the substrate surface, and gas which is reflected from the substrate surface and circulates to the air blower 32 do not interfere with each other but flow smoothly. By heat of the high temperature gas, solder paste of the substrate W loaded with parts is reflowed.
SUZUKI KIYOSHI
ONOZAKI JUNICHI
FUJII MAMORU
ABE YOSHINOBU
SOTONO KAZUO
UCHIDA TOSHIYA
