Title:
PHOTO SOLDER RESIST COMPOSITION
Document Type and Number:
Japanese Patent JPH0527438
Kind Code:
A
Abstract:
PURPOSE: To obtain a photo solder resist suitable for use in a process for producing a printed circuit board.
CONSTITUTION: This photo solder resist compsn. contains resin curable with active energy beams and a compd. having at least one epoxy group. The resin is obtd. by allowing a copolymer of ≥6C α-olefin with maleic anhydride and one or more kinds of other radical-polymerizable monomers added if necessary or a partial reaction product of the copolymer to react with a compd. having an unsatd. double bond and a hydroxyl group in the molecule.
Inventors:
KUBOTA HIROYUKI
SUZUKI YOSHIKO
TSURUTA HIROAKI
SUZUKI YOSHIKO
TSURUTA HIROAKI
Application Number:
JP20346691A
Publication Date:
February 05, 1993
Filing Date:
July 19, 1991
Export Citation:
Assignee:
TOYO INK MFG CO
International Classes:
G03F7/027; G03F7/031; G03F7/032; G03F7/038; H01L21/027; H05K3/28; (IPC1-7): G03F7/027; G03F7/031; G03F7/032; G03F7/038; H01L21/027; H05K3/28
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