Title:
STABILIZING MATERIAL FOR SUPERCONDUCTOR
Document Type and Number:
Japanese Patent JPH0721851
Kind Code:
A
Abstract:
PURPOSE: To provide a stabilizing material for superconductor capable of approximating the synthetic specific ratio to that of aluminium material alone under extremely low temperature and high magnetic field with copper clad-aluminum constitution.
CONSTITUTION: A stabilizing material for superconductor has a composite material constitution in which an aluminium material 22 is covered with a copper material 23, and an alumina layer 27 which is an electric insulating material is scattered and distributed on the boundary surface between the aluminum material 22 and the copper material 24.
Inventors:
NAKAYAMA SHIGEO
Application Number:
JP18939893A
Publication Date:
January 24, 1995
Filing Date:
June 30, 1993
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01B12/02; H01L39/00; (IPC1-7): H01B12/02; H01L39/00
Attorney, Agent or Firm:
Takehiko Suzue
Next Patent: 磁気記録媒体