LEAD FRAME AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING SAME

Title:

LEAD FRAME AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING SAME

Document Type and Number:

Japanese Patent JPH0677382

Kind Code:

A

Abstract:

PURPOSE: To obtain a lead frame in which positioning can be accurately conducted in the case of processing, electric various characteristics are provided in a state that a semiconductor device is coupled to the frame.

CONSTITUTION: A lead frame 11 is formed by supporting inner frames 17A-17D to outer ends of outer leads 14, forming a plurality of positioning holes 19A, 19B and 19C at the frames 17A-17D, and coupling such lead pattern 30 to inner ends of coupling frames 21A, 21B by a hanging lead 23 having a strong strength and a hanging lead 24 having a weak strength at its outer periphery. Thus, at the time of a burn-in testing step, the pattern 30 is supported in a floated state only by the lead 24, and hence a positional relationship between the lead 14 and an electrode of a socket is not affected by influence of thermal expansion of the frames 21A, 21B.

Inventors:

HOKARI SUMIO
KAKO KINSHI
OSHIMA NOBUO
SAITO TAKASHI

Application Number:

JP22849292A

Publication Date:

March 18, 1994

Filing Date:

August 27, 1992

Export Citation:

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Assignee:

SONY CORP

International Classes:

G01R31/26; H01L21/66; H01L23/50; (IPC1-7): H01L23/50; G01R31/26; H01L21/66

Attorney, Agent or Firm:

Mitsuo Takahashi

Next Patent: LEAD TERMINAL AND MANUFACTURE OF ELECTRONIC COMPONENT WITH THE TERMINAL