Title:
【発明の名称】ICデバイスのコンタクト機構
Document Type and Number:
Japanese Patent JP2600392
Kind Code:
B2
Abstract:
PURPOSE:To enable non-contact running of a lead with a lead holder by clamping an IC device between a clamp member and a base member while the IC device runs, by a member guiding the opposite-side corners of a package and by the clamp member which can be brought into contact with and separated from the lead and the back side of the package. CONSTITUTION:The title mechanism is constructed of a base guide 30 having a running passage 31 of an IC device D on the surface and of a roof guide 40 comprising a package guide member 41 and a clamp member 42. When the device D runs between the guide 30 and the roof 40, they are held so that a guide face 41a of the member 41 is spaced by a gap l1 from the back side of the device D. Therefore, it runs downward smoothly under its own weight between the guide face 41a and the running passage 31. A lead holder 43 and a package holder 44 of the member 42 are spaced from the device D by a larger gap l2 than the gap l1, and therefore a lead L does not come into sliding contact with the lead holding member 43 while it runs. By this constitution, exfoliation of a plating layer of the lead L by friction and sticking thereof to the member 43 can be prevented.
Inventors:
Okitsu Hikari
Toyoaki Kobayashi
Toyoaki Kobayashi
Application Number:
JP24501789A
Publication Date:
April 16, 1997
Filing Date:
September 22, 1989
Export Citation:
Assignee:
Hitachi Electronics Engineering Co., Ltd.
International Classes:
H01L21/66; G01R31/26; (IPC1-7): G01R31/26
Domestic Patent References:
| JP63120179U |
Attorney, Agent or Firm:
Shunji Kagei