Title:
MANUFACTURE OF WIRING BOARD ASSEMBLY
Document Type and Number:
Japanese Patent JP2505982
Kind Code:
B2
Abstract:
PURPOSE: To increase the yield in the punching of bus bars and the wiring density.
CONSTITUTION: A piece 6 for coupling punched bus bars 1, 1' is cut off in the center thereof to produce coupling pieces 6', 6' which are then bent to form stop claws 2', 2' integrally on the side edges of the bus bars 1, 1'. The stop claws 2', 2' are press fitted into a hole made in an insulating plate 3.
Inventors:
Groundwork
Shigenobu Tanabe
Shigenobu Tanabe
Application Number:
JP18450994A
Publication Date:
June 12, 1996
Filing Date:
August 05, 1994
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
H02G5/06; H05K3/20; (IPC1-7): H02G5/06
Domestic Patent References:
| JP55144710A | ||||
| JP54135379A | ||||
| JP6038020U |
Attorney, Agent or Firm:
Hideo Takino (1 outside)