Title:
【発明の名称】半導体装置におけるリードの製造方法
Document Type and Number:
Japanese Patent JP2575749
Kind Code:
B2
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Inventors:
ABE MITSUO
Application Number:
JP28384187A
Publication Date:
January 29, 1997
Filing Date:
November 10, 1987
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01G4/228; H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP6086852A |
Attorney, Agent or Firm:
Keizo Okamoto