Title:
SEMICONDUCTOR ELEMENT COOLING DEVICE
Document Type and Number:
Japanese Patent JPH0730023
Kind Code:
A
Abstract:
PURPOSE: To provide a semiconductor cooling device which can be made small in size, and weight can be reduced and heat carrying power can be enhanced.
CONSTITUTION: A heat receiving block 3 is attached to one side of an airtight container 1, and heat radiating fins 4 are attached to the other side of the airtight container 1. An inner tube 11 is attached to almost all regions of a heat insulating part 7 and a condensation part 6 inside the airtight container 1 through the intermediary of a retainer 12. An inner tube 11 is formed in such a manner that a proper gap is formed between its outer circumference and the airtight container, and the end part on the side of the heat insulating part 7 is widened in tapered form.
Inventors:
HASHIMOTO TAKASHI
Application Number:
JP17276593A
Publication Date:
January 31, 1995
Filing Date:
July 13, 1993
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L23/427; (IPC1-7): H01L23/427
Attorney, Agent or Firm:
Noriyuki Noriyuki
Next Patent: PIN-FIN GROUP TYPE HEAT SINK OF LARGE CAPACITY