Title:
SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3053675
Kind Code:
B2
Abstract:
PURPOSE: To easily realize the surface protection of a semiconductor element provided with a straight wall type bump.
CONSTITUTION: The surface of a semiconductor element is protected by providing a residue layer 21 obtained by half-etching a resist layer 19 which becomes the mask when a straight wall type bump 20 is formed.
Inventors:
Kazutaka Shibata
Application Number:
JP25861191A
Publication Date:
June 19, 2000
Filing Date:
September 09, 1991
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L21/60; H01L21/321; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Tsutomu Sugitani