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Title:
EMBOSS TRANSFER METHOD
Document Type and Number:
Japanese Patent JPH071826
Kind Code:
A
Abstract:

PURPOSE: To continuously and efficiently produce a product wherein patterns are provided only to emboss recessed parts by superposing the surface of the adhesive layer of a transfer sheet on the surface of a receiving base material and applying thermal processing to the transfer sheet and the receiving base material by an embossing plate not only to form emboss recessed parts to the surface of the receiving base material but also to transfer patterns to the emboss recessed parts.

CONSTITUTION: A transfer sheet is constituted by successively laminating a transfer sheet base material 1, a release layer 2, a pattern ink layer 3 and an adhesive layer 4. For example, the pattern ink layer 3 is constituted by providing a colored solid ink layer in monochromatic or multicolor printing solid or gradation patterns. The surface of the adhesive layer 4 of the transfer sheet and the surface of a receiving base material 5 are superposed one upon another and heated by the protruding parts of an embossing plate 6 not only to form the emboss recessed parts 7 corresponding to the protruding parts of the embossing plate 6 on the surface of the receiving base material 5 but also to transfer patterns to the emboss recessed parts 7. By this method, a product wherein patterns are provided only to the emboss recessed parts 7 can be produced continuously and efficiently.


Inventors:
FUKUDA TETSUYA
SUGA TAKETOSHI
Application Number:
JP17210293A
Publication Date:
January 06, 1995
Filing Date:
June 21, 1993
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B41M3/12; B41M5/00; (IPC1-7): B41M3/12; B41M5/00
Attorney, Agent or Firm:
Atsumi Konishi



 
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