Title:
PRODUCTION OF CERAMIC SUBSTRATE
Document Type and Number:
Japanese Patent JPH0585835
Kind Code:
A
Abstract:
PURPOSE: To suppress the generation of warpage or waving of a ceramic sheet in the binder-removing process at the start of baking in the production of a ceramic substrate for composite part comprising the punching of a ceramic green sheet in rectangular form and baking of the punched sheet and, as a result, to remarkably decrease the cracking defect ratio in the screen printing of an electrode on the baked ceramic substrate.
CONSTITUTION: A rectangular piece 1 is punched out from a ceramic green sheet. At least two sides of the circumference of the punched piece are provided with semicircular or V-shaped notches and the piece is baked to obtain a ceramic substrate.
Inventors:
HARADA NOBUYUKI
NAGAI HIDEO
NAGAI HIDEO
Application Number:
JP27844991A
Publication Date:
April 06, 1993
Filing Date:
September 30, 1991
Export Citation:
Assignee:
TAIYO YUDEN KK
International Classes:
B28B1/30; C04B35/64; (IPC1-7): B28B1/30; C04B35/64
Attorney, Agent or Firm:
Maruoka Masahiko
Next Patent: SCALING DEVICE FOR INPUT WAVEFORM