Title:
【発明の名称】フィルム接着剤およびその製造方法
Document Type and Number:
Japanese Patent JP3093064
Kind Code:
B2
Abstract:
PURPOSE:To obtain a highly reliable film adhesive which has a low water absorptivity, a high heat resistance, and a good workability in adhesion. CONSTITUTION:This film adhesive is obtd. by using, as the main component, an org.solvent-sol. polyimide resin which is obtd. by reacting an acid component comprising a¦¦x¦¦ mol of 4,4'-oxydiphthalic dianhydride and b¦¦x¦¦ mol of pyromellitic anhydride with an amine component comprising c¦¦x¦¦ mol of 2,2- bis[4-(4-aminophenoxy)phenyl]propane, d¦¦x¦¦ mol of 1,3-bis(3-aminophenoxy) benzene and/or dimethylphenylenediamine, and e¦¦x¦k mol of alpha,omega-bis(3- aminopropyl)polydimethylsiloxane in such molar amts. of (a), (b), (c), (d), and (e) as to satisfy the relations: a/(a+b)>=0.8, b/(a+b)<=0.2, and 0.05<=e/(c+d+e)<=0.5 and subjecting the reactional product to imidation by cyclization. The adhesive, contg. little impurities and releasing very little gaseous matters on heating, is very useful industrially as a material for microelectronics and semiconductor mounting.
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Inventors:
Tatsuhiro Yoshida
Yoshitaka Okugawa
Toshio Suzuki
Yoshitaka Okugawa
Toshio Suzuki
Application Number:
JP32501992A
Publication Date:
October 03, 2000
Filing Date:
December 04, 1992
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C09J7/00; C08G73/10; C09J179/08; (IPC1-7): C09J179/08; C08G73/10; C09J7/00
Domestic Patent References:
| JP5179224A |